this is information on a product in full production. november 2013 docid16971 rev 3 1/9 1n6640u aerospace 0.3 a - 75 v switching diode datasheet - production data features ? surface mount hermetic package ? high thermal conduct ivity materials ? very small conduction losses ? negligible switching losses ? extremely fast switching ? low forward voltage drop ? target radiation qualification ? 150 krad (si) low dose rate ? 3 mrad (si) high dose rate ? package mass: 0.12 g description packaged in lcc2d this device intended for use in low voltage, high frequency inverters, free wheeling, polarity protection and other aerospace applications. a k k a leadless chip carrier 2 (lcc2d) table 1. device summary (1) order code escc detailed specification quality level lead finish eppl i f(av) v rrm t j(max) vf (max) 1n6640ud1 engineering model gold 0.3 75 175 1,06 1N6640U01D 5101/027/07 escc gold target 1n6640u02d 5101/027/08 escc solder dip 1. contact st sales office for information about t he specific conditions for products in die form. www.st.com
characteristics 1n6640u 2/9 docid16971 rev 3 1 characteristics to evaluate the conduction loss es use the following equation: p = 0.74 x if(av) + 1.00 x i f 2 (rms ) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 75 v i f(rms) forward rms current 0.5 a i f(av) average forward rectified current (1) 300 ma i fsm forward surge current t p = 8.3 ms sinusoidal, t amb ? 25 c 2a t stg storage temperature range -65 to +175 c t j operating junction temperature range -65 to +175 c t sol maximum soldering temperature (2) 245 c 1. for all variants at t c ? +155 c per diode, derate linearly to 0 a at +175 c. 2. maximum duration 5 s. the same package must not be re-soldered until 3 minutes have elapsed. table 3. thermal resistance symbol parameter value unit r th (j-c) junction to case (1) 60 ? c/w r th (j-a) junction to ambient 280 1. package mounted on infinite heatsink table 4. static electrical characteristics symbol parameter tests conditions min. typ. max. unit v br (1) breakdown voltage t j = 25 c i r = 10 a 75 - - v i r (1) reverse current t j = 25 c v r = 50 v - - 40 na t j = 150 c - - 30 a v f (2) forward voltage t j = 25 ? c i f = 1 ma 540 - 630 mv t j = 25 ? c i f = 50 ma 760 - 890 t j = 25 ? c i f = 100 ma 820 - 980 t j = 25 ? c i f = 200 ma 870 - 1100 t j = -55 ? c i f = 200 ma - - 1200 1. pulse test: tp = 10 ms, < 2% 2. pulse test: tp = 680 s, < 2%
docid16971 rev 3 3/9 1n6640u characteristics 9 table 5. dynamic characteristics symbol parameter test conditions min. typ. max. unit t rr reverse recovery time i f = i r = 10 ma - - 9 ns i f = 1 a, v r = 30 v, di/dt = -15 a/s 20 v fp forward recovery voltage i fm = 200 ma - - 5 v t fr forward recovery time i fm = 200 ma - - 20 ns c j diode capacitance v r = 0 v, v = 50 mv, f = 1 mhz - - 3 pf figure 1. forward voltage drop versus forward current (typical values) figure 2. forward voltage drop versus forward current (maximum values) i (a) fm 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 t j =-55 c t j =150 c t j =150 c t j =25 c t j =25 c v (v) fm i (a) fm 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 t j =-55 c t j =150 c t j =150 c t j =25 c t j =25 c v (v) fm figure 3. reverse leakage current versus reverse voltage applied (typical values) figure 4. relative variation of thermal impedance, junction to case, versus pulse duration i (na) r 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 0 1020304050607080 t j =150 c t j =25 c t j =75 c v (v) r z/r th th(j-c) (j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-06 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse t (s) p
characteristics 1n6640u 4/9 docid16971 rev 3 figure 5. junction capacitance versus reverse voltage applied (typical values) c(pf) 0.1 1.0 10.0 1 10 100 f=1 mhz v osc =30 mv rms t j =25 c v (v) r
docid16971 rev 3 5/9 1n6640u package information 9 2 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 6. leadless chip carrier 2 (lcc2d) package dimension definitions 1. the anode is identified by metalization in two top internal angles and the index mark. pin 2 cathode pin 1 anode 2 1 2 1 r2 r1 g e i h e note 1 note 1 note 1 f d a b c
package information 1n6640u 6/9 docid16971 rev 3 table 6. leadless chip carrier 2 (lcc2d) package dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a (1) 1. measurement prior to solder coati ng the mounting pads on bottom of package 1.86 2.03 2.20 0.073 0.080 0.087 b 4.44 4.57 4.77 0.175 0.180 0.188 c 1.84 1.97 2.10 0.072 0.078 0.083 d 1.53 1.70 1.87 0.060 0.067 0.074 e 0.48 - 0.71 0.019 - 0.028 f - 1.3 - - 0.051 - g - 1.67 - - 0.066 - h - 0.37 - - 0.015 - i - 0.15 - - 0.006 - r1 - 0.15 - - 0.006 - r2 - 0.20 - - 0.008 -
docid16971 rev 3 7/9 1n6640u ordering information 9 3 ordering information 4 other information 4.1 date code date code is structured as describe below: ? em xyywwz ? escc flight yywwz where: ? x (em only): 3, assembly location rennes (france) ? yy: last two digits year ? ww: week digits ? z: lot index in the week 4.2 documentation in table 8 is a summary of the documentation provided with each type of products. table 7. ordering information (1) 1. contact st sales office for information about t he specific conditions fo r products in die form. order code escc detailed specification package lead finish marking (2) 2. specific marking only. the fu ll marking includes in addition: for the engineering models: st logo, date code, country of origin (fr). for escc flight parts: st logo, date code, country of orig in (fr), esa logo, serial number of the part within the assembly lot. eppl mass packing 1n6640ud1 - lcc2d gold 6640 - 0.12 g waffle pack 1N6640U01D 5101/027/07 gold 510102707 target 1n6640u02d 5101/027/08 solder dip 510102708 - table 8. documentation provided with each type of products quality level documentation engineering model escc flight certificat e of conformance
revision history 1n6640u 8/9 docid16971 rev 3 5 revision history table 9. document revision history date revision changes 26-mar-2010 1 first issue. 23-sep-2011 2 updated order codes in table 1 ta ble 7 . 8-nov-2013 3 updated table 1 , table 5 and table 7 and inserted other information .
docid16971 rev 3 9/9 1n6640u 9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems wi th product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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